North America’s first zero-emission hydrogen “Train de Charlevoix” will enter service in Canada this summer, with speeds of up to 85 mph, emitting only water vapor. Germany rolled out the world’s first fleet of passenger trains in 2022.
United States Ministry of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, as part of the bipartisan Infrastructure Act passed in 2022. “Making clean hydrogen from abundant renewable energy provides America with another incredibly powerful fuel for many different applications, from low-emissions use in the construction and manufacturing industries to storage. from energy to powering our cars and trucks,” said US Secretary of Energy Jennifer M. Granholm. The initial phase of the application concept document is due on April 19, 2023 and full applications are due on July 19, 2023.
Europe and Japan are the leaders in filing patents on hydrogen technology, followed by the United States Nicholas is targeting Canada as a promising market for the company’s full-cell hydrogen trucks.
Hong Kong, meanwhile, has developed an off-grid hydrogen EV charger, providing a bridge between two clean fuel technologies.
key sight added its O-RAN test platform, Keysight Open RAN Architect (KORA) Solutions, to CableLabs 5G Labs to support teams that NISTand the United States Ministry of Energyof the 2023 5G challenge.
Data centers have a range of cooling approaches. The problem is not solved, but there are refinements of older approaches and some innovative ideas that give hope of better balancing the demands.
ESA says its new ViPack Fanout Package-on-Package (FOPoP) has lower latency and higher bandwidth for network and mobile applications. The wrap reduces electrical path by 3x and increases bandwidth density by up to 8x, according to ASE. The engine bandwidth can expand up to 6.4 Tbps per unit. FOPoP can be used for application processors, packaged antenna devices, and silicon photonics (SiPh) applications.
MIPS, AshAnd You order work together to support RISC-V developers designing for the automotive, HPC and data center markets, as well as communications and networking. The collaboration brings together Imperas’ reference designs for the MIPS eVocore P8700 RISC-V multiprocessor, Ashling’s RiscFree SDK tools, and MIPS’ new RISC-V flexible computing solutions.
Renesas has extended its 32-bit RA microcontrollers (MCUs) for applications requiring high performance in small packages such as sensing, gaming, wearables and appliances. The RA MCUs have new clusters based on the Arm Cortex-M33 core with Arm TrustZone technology, a 100 MHz RA4E2 cluster and a 200 MHz RA6E2 cluster with 128 KB and 256 KB flash and 40 KB SRAM options.
key sight also announced that it has a 2 GHz real-time spectrum analysis solution to monitor satellite signals and interference. Satellite network operators can use the system to monitor service quality.
NXP Semiconductors announced a new single-chip solution for NFC authentications with a customizable ARM Cortex microcontroller, NFC reader, and SESIP Level 2 security.
Over the next 20 years, chips will be the enablers, requiring massive investments in new technologies, new materials and new manufacturing processes. How to continue to build chips will require substantial changes in every manufacturing and packaging process.
Market analyst firm MarketsandMarkets claims the automotive IoT market will reach $322 billion by 2028, growing at a compound annual growth rate (CAGR) of 19.7% from 2023 to 2028.
Infineon And Continental are working on server-based motor vehicle architectures, which organize a vehicle’s electronics into a few areas with a few powerful area control units (ZCUs) and high-performance central computers (HPCs). These zones would replace the hundred or more individual control units. Continental uses Infineon’s AURIX TC4 microcontroller for its ZCU platform. The TC4 introduces Infineon’s RRAM (resistive random access memory) to automotive use.
Codasip And AND are working together to offer automotive developers a way to launch ISO 26262 qualified in-vehicle applications based on Codasip’s RISC-V L31 core. Developers will be able to use the functional safety certified version of the IAR’s development tool chain, the IAR Embedded Workbench for RISC-V, to design low-power embedded automotive applications. “The automotive market is changing rapidly, driven by increased needs for accelerated innovation with reduced complexity and cost. RISC-V offers exactly that,” said Jamie Broome, Vice President of Automotive Business and Products at Codasip in a press release. “Codasip provides custom computation with full ownership and control. Through our collaboration with the IAR, we provide automotive companies with a simple solution to certify their products to ISO 26262 and other functional safety and security standards.
Siemens will demonstrate CO visualization systems2 emissions in logistics networks at a transport logistics fair in Munich, May 9-12, 2023. The system uses a method based on the international standard GLEC (Global Logistics Emission Council) to calculate emissions and understand where find the polluters in the supply and transport chain. The company will also show a way to improve supply chains with digital twins and a control tower that synchronizes production and supply processes in real time.
Chips may suffer more from self-heating in the future, but techniques are being explored to mitigate this self-heating.
PDF Solutions And Voltaic bring their know-how together to help battery manufacturers increase yield, reduce costs and accelerate the construction of electric vehicle battery factories. PDF Solutions’ Exensio Process Control and Manufacturing Analytics platform is combined with Voltaiq’s Enterprise Battery Intelligence platform, which will help customers assess battery quality earlier in production.
Risks released an update to its True Code embedded software security platform. The True Code 2023.1 update redesigned the fuzzing and simulation (dynamic testing) features into benchmarks. A server API and a new hardware abstraction layer (HAL) are also included for creating mock implementations of memory-mapped devices. Riscure has also updated its Glitch Amplifier, hardware for fault injection testing.
Risks aid Thales obtain the first GSMA consumer device certificate for its QualcommiSIM product based on SGP, which met all the requirements of the SGP.25 protection profile. Riscure executed the security assessment campaign.
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Events to come
- IRPS 2023 – International Reliability Physics Symposium, March 26 – March 30
- International Symposium on Physical Design (ISPD), March 26 – March 29
- Tiny ML Summit 2023, March 27-29
- MEMCon 2023: Next Generation Data Centers, Memory Innovation and CXL, March 28 – March 29
- The Impact of New Regulations on the Semiconductor Design Ecosystem (hosted by ESD Alliance), March 28, 8:30-11:30 am PDT
- SNUG Silicon Valley, March 29 – March 30
- RSA Conference 2023, from April 24 to April 27
- SPIE Optics + Optoelectronics 2023, April 24 – April 27
- IEEE International Symposium on Hardware-Oriented Security and Trust (HOST), May 1-May 4
- IEEE Symposium on Security and Privacy, May 22-25
- SEMICON West 2023, July 11-13
See more events on our events page.
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